SLP-9118B-51-T1 no.6226 1/6 sanyo electric co.,ltd. semiconductor company tokyo office tokyo bldg., 1-10, 1 chome, ueno, taito-ku, tokyo, 110-8534 japan ordering number : en6226 SLP-9118B-51-T1 infrared led ?3.1mm red contact type taping lamp 81099 gi, ( mi ) features gaasp red green led 3.1mm?, round top type lamp diffused red resin package type high luminous intensity, high reliability and long life slp-9118b-51 taping type for an antomatic use the insertion which made it stick to pcb is possible application : for the general public welfare absolute maximum ratings at ta=25 c (as per jis c 7032) parameter symbol rating unit forward current * 1 i f 25 ma pulse forward current * 2 i fp 100 ma reverse voltage v r 3v power dissipation p d 70 mw operating temperature topr --25 to +80 c storage temperature tstg --30 to +85 c soldering temperature * 3 tsol 260 c * 1 see forward current derating * 2 pulse width = max. 10ms duty ratio = max. 1 / 10 * 3 max. 5sec., lead soldering condition : min. 1.6mm from case (used 1.6mmts pcb) electrical / optical characteristics at ta=25 c parameter symbol conditions min typ max unit foward voltage v f i f = 20ma 1.7 2.1 2.8 v reverse current i r v r = 3v -- -- 10 m a luminous intensity * 4 i v i f = 20ma 8 20 -- mcd peak wave length l p i f = 20ma -- 630 -- nm line half width dl i f = 20ma -- 40 -- nm capacitance c o v o = 0 f = 1mhz -- 40 -- pf response time t -- -- 90 -- ns * 4 luminous intensity is measured by j-16 (sony tektronix) of which our office possess. 1.55 2 2 max (not soldered) 3.2 1 5.2 0.4 5.5 0.5 10.2 0.5 0.8 max 29.5 1 ?.4 ?.1 anode cathode 2.5 (1.5) 0.5 0.4 note : material -- lron coating -- solder lead center off : 0.4 unit : mm
SLP-9118B-51-T1 no.6226 2/6 typical characteristics these shows the electrical and optical characteristics of this products, and not assure this dispersive contents. caution 30 20 10 5 3 2 1 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 1.5 1.0 0.5 --40 --20 0 20 40 60 80 100 1 2 5 10 20 50 100 200 500 550 600 650 700 010 30 20 40 50 60 70 80 90 100 10 5 2 1 0.5 0.2 0.1 1.0 0.5 0 35 30 25 20 15 10 5 0 90 80 70 60 50 40 30 20 10 0 90 80 70 60 50 40 30 20 10 1.0 0.1 0.5 forward current vs. forward voltage forward current (ma) forward voltage (v) intensity vs. temperature (i f : constant) relative intensity temperature ( c) intensity vs. current relative intensity forward current (ma) spectrum relative intensity wave length (nm) forward current derating (abusolute maximum rating) forward current (ma) temperature ( c) directivity
SLP-9118B-51-T1 no.6226 3/6 adhesive tape pasteboard t w w0 w2 l1 ?0 p0 f' anode cathode w1 h ? p2 f d p1 5.5 0.5 5.2 0.2 d s p d h (unit : mm) item sym nominal tolerance note led pitch p 12.7 1.0 sending hole pitch p0 12.7 0.2 * sending hole slip out p1 5.1 0.5 sending hole slip out p2 6.35 0.5 slant of led lamp d h, d s0 1.0 width & dia. of led lamp d 3.1 0.2 interval of lead d 0.4 0.2 space of lead f 2.5 0.7 space of lead f ' (2.5) ----- distance from led lead h 18.0 1.0 dia.of sending hole d0 4.0 0.2 lead slip out i max2.0 ----- width of pasteboard w 18.0 0.5 width of adhesive tape w0 13.0 0.5 sending hole slip out w1 9.0 0.5 adhesive tape slip out w2 0.5-1.5 ----- thickness of pasteboard t 0.5 0.2 ** cutting position of rejected l1 max11.0 ----- *accumulated pitch error : 1 / 20 pitch **included thickness of adhesive tape
SLP-9118B-51-T1 no.6226 4/6 1. general description these items are applide to taping type led lamps for automatic use. 2. taping specification appearance and dimensions. (refer to the supplementary drawing) 3. notes (1)the polarity of led lamp should be reqularly oriented to one direction. (2)sequential cracks in a taped unit shall be 3 pcs. max. pasteboard adhesive tape w (3)peeling adhesive strength of tape peeling in the vertical direction against the taped surface should be more than 300g. (see below) (4)tape conjunction method 1 in the case of tape pasteboard cutting ? scotch tape is applied to connect or fix between tapes from the back side of the pasteboard. forward direction adhesive tape pasteboard scotch tape approx. 20mm ? max. tickness of the tape should be less than 1.1mm. 2 how to fix disconnected tape p0 p0 fixed by adhesive tape 1max ? methode by adhesive tape : stick over fixing each adge. note : taping pitch (p0) should be placed properly. in the case of applying sticking way, the location is to be voluntary. 4. packaging (1)the quantity is indicated on a packing case. (2)packaging appearance and dimensions. (see right) 1 winding path will be emloyed as a packing method. 2 when led lamps are taken out of a packing case, follow the led polarity configuration. (see below) 3 packaging display sewing machine stitch 340max 320max 55max m / m
SLP-9118B-51-T1 no.6226 5/6 < automatic stick inserting, straight taping type > (1) bending a lead should avoid not to cause chip deterioration or so. when bending is necessary, care must be taken considering the following points : q bending a lead must be done before soldering. w a lead must be bent at intervals of 1.6mm from the edge of the regin part. e do not bend the same portion of lead more than twice. (2) setting a product by a tool such as holder should avoid. when necessary, no stress should be applied to the regin part and lead by sufficient considerations on dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board. (3) the hole pitch of a circuit board must fit to its lead pitch. (4) when soldering, care must be taken considering the following points : q do not heat a product under any stress (ex. : twist) to leads. w do not heat (by soldering, for example) a product in the states of being forced to the resin part. (5) do not use the flux containing chlorine (max. 0.2wt%) which may cause corrosion of lead and washing is preferable. when washing is necessary, avoid washing the whole product and wash only the needed part under the following conditions. ? chemicals : methyl alchole. ? temperature : 45 c max. ? time : 30sec. max. note :recommendatory conditions of automatic insertion and reflow (adhesive hardening process) taping lamp is automatically inserted and the chip portion is attached to the back side. when using taping lamp in the process through reflow furnace, follow the initial conditions in the new process to prevent gold wire breaking in process of led manufacturing and to secure high reliability. (1)setting of automatic insertion machine q speed : not more than 1.0sec. / p. w chuch pressure : not more than 3.0kg / cm 2 . e head pressure : not more than 1.0kg / cm 2 . r clinch angle : bendingangle. --anode side within 15 --cathode side within 45 t cutter : to avoid tearing lead off, use of sharp and hard cutter withstanding 1million time in preferable. (2)pre-hardening furnace q temperature : when hardening chips by adhesive at 150 c(120sec), set the surface temperature of led regin part to 120 c or less ; even influence of increase in temperature to the back side of led part is low. (temperature of 130 c is about the line that causes deformation (heat deflection temperature) of regin used in standard led. if temperature is increased while stress is on lead, even small, resin is softened and the life of held lead is lowered. this may cause gold wire breaking due to moving lead.) (3)solder dipping q temperature of soldering bath : 260 c or less. w dipping time : within 5sec. e lead soldering condition : min 1.6mm from case. precautions 45 min. cathode 15 min. anode
SLP-9118B-51-T1 no.6226 6/6 caution 1. no products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster / crime-prevention equipment or the like, and the failure of which may directly or indirectly cause injury, death or property loss. 2. anyone purchasing any products described or contained herein for an above-mentioned use shall: 1) accept full responsibility and indemnify and defend sanyo electric co.,ltd., its affiliates, subsidiaries and distributors or any of their officers and employees, jointly and severally, against any and all claims and litigation and all damages, costs and expenses associated with such use. 2) not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on sanyo electric co., ltd., its affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. 3. information (including circuit diagrams and circuit parameters) disclosed herein is for example only; it is not guaranteed for mass production, sanyo believes the information disclosed herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. precautionary instructions in handling gallium arsenic products special precautions must be taken in handling this product because it contains, gallium arsenic, which is designated as a toxic substance by law. be sure to adhere strictly to all applicable laws and regulations enacted for this substance, particularly when it comes to disposal. manufactured by ; tottori sanyo electric co., ltd. led division 5-318, tachikawa-cho, tottori city, 680-8634 japan tel: +81-857-21-2137 fax: +81-857-21-2161 ps
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